What can result from improper bonding in communication installations?

Improper bonding in communication installations can significantly increase the risk of electromagnetic interference. Bonding refers to the electrical connection between various network components and grounding systems, which is essential for providing a common electrical reference and minimizing the potential difference between different parts of the system. When bonding is not done properly, it can lead to issues such as loop currents and voltage differentials, which can interfere with the signals being transmitted. This electromagnetic interference can manifest in various ways, such as degraded signal quality, increased error rates in data transmission, and overall reduced performance of communication systems.

The other options suggest outcomes that are not associated with improper bonding. For example, increased network speed, improved data integrity, and higher signal clarity all imply enhancements in the system's operations, which are unlikely to result from improper bonding practices. In fact, these outcomes may be compromised when bonding is inadequate, supporting the conclusion that risk factors such as electromagnetic interference become more pronounced.